Description and Requirements
Key Responsibilities
Interconnect Solution Development
- Develop and support interconnect solutions for AI servers, GPU, rack-level, and cluster-level platforms.
- Define cable and connector requirements based on system architecture, SI requirements, power delivery, thermal, and mechanical (and manufacturability) constraints.
- Support advanced interconnect applications, including:
- High-speed copper and optical interconnects
- Patch panels
- Optical cable assemblies
- Cable cartridge solutions
- Inter-rack DC link high-power connectivity
- Collaborate with SL, EE, SI, ME, Thermal, and System teams (and Manufacturing) to ensure robust (and scalable) interconnect architecture integration.
High-Speed Interconnect Technology
- Support high-speed interconnection technologies, including (400G / 800G) interconnect solutions and future high-bandwidth AI infrastructure connectivity solutions.
- Evaluate and drive implementation readiness for emerging technologies such as PCIe Gen6/Gen7, UALink,NVLink, high-speed optical interconnects, and next-generation GPU cluster connectivity solutions.
- Drive technology readiness assessment and solution feasibility studies according to industry technology trends.
- Develop strategic supplier technology roadmaps aligned with future AI infrastructure interconnect technologies and deployment requirements.
NPI & Engineering Support
- Lead and drive interconnect implementation activities throughout all NPI phases from concept development through EVT/DVT/PVT and sustaining.
- Own cable and connector component's part list management, and interconnect technical documentation.
- Conduct NUDD analysis, engineering trade-off studies, risk analysis, and design reviews for Interconnect solutions.
- Lead sample verification, prototype bring-up, debugging, issue resolution and second source introduction during development phases.
Supplier Development & Component Qualification
- Lead and develop strategic suppliers include technical engagement, capability assessment, and manufacturing readiness reviews.
- Define and execute qualification plans and reliability requirements for cable and connector components.
- Assess technical impact of PCN/PCR changes and define mitigation actions.
- Maintain interconnect qualification records, databases, and lifecycle documentation.
- Drive cost optimization, AVL strategy, and supply continuity planning.
Required Qualifications
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
- 5+ years of experience in server, networking, storage, HPC, AI infrastructure, or high-speed interconnect engineering
- Strong knowledge of:
- High-speed cable and connector architectures
- Signal and power interconnect systems
- Qualification and reliability validation methods
- Rack-level and cluster-level interconnect solutions
- Experience working with ODM/OEM, EMS, and component suppliers.
- Strong cross-functional communication, technical problem-solving, and project execution skills.
Preferred Qualifications
- Experience supporting AI server, GPU server, HPC, networking, or data center platforms.
- Familiarity with high-speed interconnect technologies (400G/800G, optical interconnect, UALink, NVLink, PCIe Gen6/Gen7, and next-generation AI fabric connectivity).
- Experience in NPI lifecycle management and supplier qualification processes.
- Understanding of signal integrity, power delivery, and thermal considerations in AI infrastructure systems.
- Experience supporting and bring-up supplier's manufacturing and development sites is a plus.
