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Qnity

ICS Technology Test Vehicle Development Leader

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  • Posted 5 days ago
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Job Description

Are you looking to power the next leap in the exciting world of advanced electronics Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics.

At Qnity, we're more than a global leader in materials and solutions for advanced electronics and high-tech industries we're a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us.

  • Strategic technology planning & Leadership
    • Define test vehicle strategy aligned with advanced packaging and interconnect technology roadmaps.
    • Collaborate with cross-functional teams (design, process integration, quality, yield rate management, reliability, and manufacturing) to ensure TVs meet technology development objectives.
    • Optimize cost management & allocation with raw materials & its supply, process design, layout design, yield rate improvement, and time to meet schedule.
    • Device bench mark strategy to meet business/product line requirements and delivery bench market report to support product line technology development.
    • Next Gen Technology involvement with vertical value supply chain from PCB MLB, mSAP/HDI, IC Substrate & advanced packaging
  • Technical Development
    • Lead test vehicle engineers to delivery TVs for product line development.
    • Lead design and layout of complex test vehicles for heterogeneous integration, advanced substrates, and interconnect structures.
    • Lead design and integration of process flow, recipe, chemistry selection, process equipment selection.
    • Continuously Improve TV manufacturing yield rate.
    • Leverage external vendor and resource to deliver technology roadmap.
    • Oversee electrical, mechanical, and thermal performance validation through TVs.
    • Lead Bench Mark technology with market trend, technology adoption trend, Innovation and related application to address business opportunity & support product line business growth.
  • Project Management
    • Manage TV development timelines, budgets, and deliverables.
    • Coordinate with external suppliers and internal stakeholders for material procurement and fabrication.
    • Cost management and allocation for initiators.
    • Tear down alignment to meet product line requirement.
  • Innovation & Problem Solving
    • Identify gaps in test methodologies and propose innovative solutions.
    • Drive continuous improvement in TV design to accelerate technology qualification.
    • Upgrade and recommendation of next on pilot line requirement.
    • Leverage equipment and raw material vendors to support TVs.
    • Leverage & establish outsourcing partner to enable full process capability.
  • Documentation & Reporting
    • Prepare technical reports, presentations, and documentation for internal and external stakeholders.
    • Support IP generation and patent filings related to TV innovations.
  • Qualifications
    • Education: Master's or Ph.D. in chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related field.
    • Core Knowledge: (1) Strong understanding of advanced packaging technologies with vertical value supply chain from PCB MLB, mSAP/HDI, IC Substrate & advanced packaging (2) Familiarity with design-for-test principles and reliability qualification methodologies.
  • 4. Experience
    • Required: 8+ years in advanced packaging or advanced PCB, HDI interconnect technology development.
    • Proven track record in leading test vehicle design and execution for technology qualification.
    • Preferred: (1) Experience with heterogeneous integration, advanced substrate design, and high-density interconnects. (2) Prior involvement in cross-functional technology development programs.
  • 5. Skills
    • Technical Skills: R&D, Process experience in advanced interconnect technology.
    • Leadership & Communication
    • Strong project management and team leadership capabilities.
    • Excellent communication skills for cross-functional collaboration and stakeholder engagement.
    • Analytical & Problem-Solving
    • Ability to analyze complex technical challenges and develop innovative solutions.
    • Strategic thinking, adaptability, and ability to work in a fast-paced environment.
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Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information.

Qnity offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page.

We use Artificial Intelligence (AI) to enhance our recruitment process.

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About Company

Job ID: 145033037