- * Lead the creation of a global memory connector engineering organization
- * Drive next-generation AI, server, and HPC memory connectivity innovation
About Our Client
Our client is a global technology leader specializing in advanced interconnect and electronic solutions serving data center, cloud computing, networking, and industrial markets. The company is investing heavily in next-generation memory technologies and expanding its engineering capabilities to support future computing architectures.
Job Description
- Build, mentor, and lead a high-performing global engineering team focused on memory connectivity products.
- Define and execute technology roadmaps for DDR5, DDR6, DIMM, SODIMM, SOCAMM, and future memory architectures.
- Lead the full product development lifecycle from concept and design through validation, qualification, and production launch.
- Partner with customers and industry ecosystem stakeholders to develop differentiated next-generation solutions.
- Drive engineering excellence across performance, cost, manufacturability, quality, and program execution.
The Successful Applicant
You are an experienced engineering leader with a strong background in connectors, interconnect technologies, semiconductor hardware, server platforms, or related electronics industries. You bring a proven track record of leading complex product development programs, managing global teams, engaging with customers at a technical level, and balancing innovation with commercial and manufacturing realities. Experience in memory connectors, high-speed signal integrity, AI infrastructure, or large-scale electronics manufacturing environments would be highly advantageous.
What's On Offer
- Opportunity to shape a new global engineering capability within a market-leading technology organization
- High visibility role working with global customers and next-generation AI and data center platforms
- Significant career growth potential with broad international leadership exposure
Contact
Quote job ref: JN-092026-7097069
