Your Job
As an Advanced Wafer Level Package (WLP) Engineer, you will lead the development of cutting-edge wafer-level packaging technologies. Your role encompasses pioneering heterogeneous integration, 2.5D/3D packaging, chiplet integration, and high-density interconnect solutions. You will develop and validate advanced packaging processes such as RDL, TSV, Hybrid Bonding, Micro-bump, and Fan-Out. Additionally, you will perform material characterization, analyze packaging structures, resolve reliability issues, and collaborate closely across functions to ensure successful technology implementation and prototype development.
Our Team
You will be part of the DSS Division, within the R&D Component Engineering department, working closely with the Advanced WLP Senior Manager and cross-functional teams including design, integration, testing, reliability, as well as external partners such as material, equipment, and substrate suppliers. Our team is dedicated to pushing the boundaries of semiconductor packaging technology through innovation and collaboration.
What You Will Do
- Develop and validate advanced wafer-level packaging processes including RDL, TSV, Hybrid Bonding, Micro-bump, and Fan-Out.
- Execute the development of heterogenous integration, 2.5D/3D packaging, chiplet integration, and high-density interconnect (HDI) solutions.
- Conduct comprehensive material characterization and analyze packaging structures to identify opportunities for process optimization.
- Define process parameters and establish design specifications to ensure manufacturability and high yield.
- Support the introduction of new technologies and prototype sample development.
- Perform failure analysis (FA) and address reliability issues to enhance product performance.
- Collaborate cross-functionally with design, integration, testing, and reliability teams to ensure seamless project execution.
- Liaise with material, equipment, and substrate suppliers to evaluate the feasibility and integration of new technologies.
Who You Are (Basic Qualifications)
- Master's degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemical Engineering, Optoelectronics, or related fields.
- Minimum of 2 years experience in semiconductor packaging or process development.
- Proficient in at least one of the following areas: RDL/Fan-Out process technology, TSV/Micro-bump/Hybrid bonding, Si interposer/CoWoS/InFO/3D IC, or material and structural reliability (thermal, mechanical, electrical).
- Strong problem-solving skills and ability to collaborate effectively across functions.
- Proficiency in reading and understanding English technical documents.
What Will Put You Ahead (Preferred Qualifications)
- Experience in wafer-level or advanced packaging technologies.
- Hands-on experience in failure analysis (FA) and reliability testing.
- Practical experience with wafer fabrication or back-end process operations.
- Up-to-date knowledge of industry trends in advanced packaging technologies.
At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.
Who We Are
As a Koch company, Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and supporting industries from automotive to health care and consumer to data communications. The thousands of innovators who work for Molex have made us a global electronics leader. Our experienced people, groundbreaking products and leading-edge technologies help us deliver a wider array of solutions to more markets than ever before.
At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.
Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.
