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Director, Outsourced Assembly and Test (OSAT) – Semiconductor (Ref: RL210826)
Location: Taiwan
Our client is a leading global semiconductor company that designs, develops, manufactures, and markets a broad range of semiconductor products. They are recognized as one of the world's leading semiconductor suppliers, combining in-house wafer fabrication with strategic outsourcing partnerships, including OSAT relationships across Asia, to scale production and meet global demand.
Responsibilities
The successful candidate will be responsible for managing the company's OSAT operations across Taiwan, Korea, and Japan
Candidate Profile
Please connect with our team to explore this exciting opportunity!
Job ID: 152973969

Skills:
WLCSP, flip chip, micro-bump, Reliability Testing, supplier engineering, heterogeneous integration, assembly test engineering, advanced semiconductor packaging, manufacturing ramp support, Cu pillar, Supplier Audits, substrate-based packages, Failure Analysis, Quality Systems, fan-out wafer-level packaging, NPI qualification, die attach, TSV, yield improvement