Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
We are looking for a Staff Engineer in Digital Test Engineering to lead test program bring‑up and validation from NPI through high‑volume manufacturing. This role focuses on resolving test issues on advanced technology nodes, improving test efficiency, and driving closure through close collaboration with cross‑functional and cross‑region engineering teams.
Key Responsibilities
- Lead test program development and bring‑up across NPI and high‑volume manufacturing stages.
- Debug and resolve issues related to coverage, test time, and yield.
- Drive test efficiency and cost reduction, including test time optimization and test flow simplification.
- Analyze test and yield data to identify trends, root causes, and improvement opportunities.
- Collaborate cross‑functionally with DFT, Design, Yield, Reliability, Product, and Test Engineers.
- Communicate clearly with technical teams and management, adjusting the level of detail as appropriate.
Minimum Qualifications
- Master's degree in Electrical/Electronic Engineering, Computer Engineering, or related field with 8+ years of Test Engineering experience (or Bachelor's degree with equivalent industry experience).
- 8+ years of hands‑on SoC test program bring‑up experience.
- Experience in one or more of the following test areas:
- Structural tests (ATPG, TDF, MBIST)
- Functional tests
- High‑speed tests
- Test‑related characterization
- High‑voltage or stress‑based test methodologies
- Hands‑on experience with Advantest 93K or Teradyne UltraFLEX / iFlex platforms.
- Proficiency in one or more programming or scripting languages (C++, VB, Java, Python).
- Experience using test or yield data analysis tools (e.g., O+, Data Power, Exensio).
- Experience with test method or test library development, including requirements definition, development, validation, regression, and enhancements.
Preferred Qualifications
- Strong Structural Test Engineering experience (ATPG, TDF, MBIST).
- Experience working on System‑on‑Chip (SoC) products.
- Experience resolving issues on advanced or leading‑edge technology nodes.
- Experience using or developing AI‑assisted applications for test automation, workflow efficiency, or engineering data analysis.
- Experience using data analysis tools such as O+, Exensio, JMP, or similar platforms for test, yield, or debug data analysis.
- Experience leading or mentoring three (3) or more junior test engineers in project environments.
- Hands‑on experience with version control systems (Git or SVN).
- Familiarity with issue tracking or ticketing systems such as JIRA.
- Experience collaborating with cross‑region engineering teams, driving alignment and issue closure across different time zones.
- Comfortable communicating in English, including participating in technical discussions and cross‑region collaboration.
Minimum Qualifications:
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
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