Search by job, company or skills

Winbond

(??)??????(CMP)???????

Winbond
Early Applicant
  • Posted a month ago
  • Be among the first 10 applicants
3-5 Years
Hong Kong

Electronic Components/Semiconductors

Job Description



()(CMP)
1. 3D-IC
2.
3.



3

No
No
1
No

1.CMP
2.Wafer thinning tool (Backside Si Trimming & Grinding )

More Info

Industry:Electronic Components/Semiconductors

Function:??????

Job Type:Permanent Job

Date Posted: 27/08/2025

Job ID: 124888433

Report Job

About Company

Winbond
View More
Last Updated: 02-10-2025 10:27:40 PM
Home Jobs in Hong Kong (??)??????(CMP)???????
Jobs by Skill - IT
Jobs by Skill - Non IT
Jobs By Role
International Jobs