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Winbond

(??)CMP?????

Winbond
Hong Kong
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  • Posted 2 months ago
  • Be among the first 10 applicants
Early Applicant

Job Description


()CMP
1.12CMP
2.
3.
4.R2R
5.Cost down/ /SPC



() ()

No
Yes

No

(.10..35)

More Info

Job Type:
Permanent Job
Industry:
Electronic Components/Semiconductors
Function:
Engineering
Employment Type:
Full time

About Company

Winbond

Job ID: 124888309

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Last Updated: 17-04-2026 04:42:53 AM
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