Responsibilities
1. Responsible for the mass production introduction of chip products, and collaborate with the R&D department and supply chain department to complete the outsourcing strategy of chip packaging and testing 2. Formulate engineering sample plans, prepare production-related Tooling, and ensure the delivery of chip engineering samples 3. Assist the R&D department and supply chain department to complete the relevant verification work at the chip NPI stage to ensure that chip products are completed on time for mass production introduction 4. Collaborate with test engineers to complete chip performance verification and yield confirmation analyze production yield data, find out the key factors affecting chip yield, take corresponding measures to ensure stable yield and gradually improve production yield, and promptly warn potential yield problems 5. Solve abnormal problems in the chip production process timely discover and deal with production abnormalities, formulate improvement countermeasures, follow up on the implementation of countermeasures and improve the results.
Qualifications
1. Bachelor degree or above, microelectronics, automation, electronic engineering and other related majors are preferred 2. At least 1-2 years of product engineering experience in semiconductor fabs, packaging plants or chip design companies 3. Applicants with engineering experience related to 2.5D/3D packaging products, or experience in semiconductor fabs will be given priority 4. Understand data statistics methods and be familiar with chip yield analysis methods 5. Understand chip reliability testing methods such as ESD, Latch-up, HTOL, etc., and failure analysis methods such as SEM, X-Ray, EMMI, SAT, etc. 6. Good teamwork spirit, serious and responsible work attitude good communication skills, and fluent English reading and writing.
