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Winbond

(??) CAD AI Program Manager

Winbond
Early Applicant
  • Posted a month ago
  • Be among the first 10 applicants
10-12 Years
Hong Kong

Electronic Components/Semiconductors

Job Description

() CAD AI Program Manager

[]
CAD AI AI AI

[]
1. AI CAD roadmap
2. IT AI
3. AI
4.
5. AI .


(.539)




10

Yes
No
1
No

1. 10CAD IT
2. AI/ML 5()
3. AI
4. EDA ( Calibre, Virtuoso, Hspice, Verdi)

#LI-LL1

More Info

Industry:Electronic Components/Semiconductors

Function:Cad Ai Program Management

Job Type:Permanent Job

Date Posted: 27/08/2025

Job ID: 124887633

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Winbond
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Last Updated: 02-10-2025 10:27:51 PM
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