Job Responsibility
- Drive process standardization, best practices, and talent retention & growth for organization sustainability
- Define, develop and establish process capabilities, strategy and roadmap
- Develop a strategy to develop new capabilities or to overcome process constraints
- Collaborate with Innovation NPI/NTI team to enable successful NPI/NTI launch with robust Safe Launch closure
- Attend and own all BCAM related review on NPI/NTI to ensure risk to process margin/manufacturability is mitigated upfront
- Constantly on the lookout for new material suppliers / new technology and capability
- Specifically on risk assessment and process flow optimization, playing the Integrator role of Assembly process from wafer to package finished good
- Ensure business continuity in process, working with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
- Maintain a matrix on process capabilities and constraints
- Work with UG/Equipment counterpart on equipment benchmarking
Job Qualification
- Bachelor Degree in relevant engineering fields
- 15 + Years of Experience in Semiconductor industry is mandatory
- Competent in package development and Wire Bond operation will be added advantage
- Certification or proven competency in problem solving, 8D, 3x5whys..
- Experience in running engineering teams in wire bond, die bond, or mold
- Strong leadership skills with good communication
- Excellent in logic thinking for data analysis and data interpretation skills
- Excellent in critical data-driven decisions
- Hands on, strong ownership, and able to collaborate as team player
Key Competencies Most Required Include
- Drives Results
- Problem Solving
- Manages Ambiguity
- Collaborates
More information about NXP in Greater China...
