Advanced Packaging Engineer
ap memory technology corp- Posted 6 hours ago
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Job Description
Responsibilities
-Evaluate and develop advanced packaging solutions (2.5D/3D IC, Chiplet, HBM, heterogeneous integration, etc.).
-Collaborate with internal teams and external partners to drive technology development.
-Conduct technical analysis, feasibility studies, and technology scouting.
-Support package design, process integration, and qualification activities.
Qualifications
-M.S. or Ph.D. in Materials Science, Electrical Engineering,
-Mechanical Engineering, Chemical Engineering, or related fields.
-Minimum 2 years of industry or academic experience in semiconductor packaging.
-Knowledge of advanced packaging technologies, materials, processes, or reliability is preferred.
Personal Attributes
-Strong teamwork and communication skills.
-Passion for learning new technologies and innovation.
-Self-motivated with a strong sense of ownership.
-Analytical problem solver with attention to detail.
-Able to work effectively in a fast-paced, cross-functional environment.
More Info
Key Skills
3D IC
HBM
Chiplet
heterogeneous integration
advanced packaging solutions
packaging technologies
materials processes
About Company
