We Are:
At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.
You Are:
- You are an expert in 3DIC and advanced packaging technologies with a solid background in BEOL wafer processing, die stacking and flip chip assembly
- You are knowledgeable about advanced packaging solutions offered by various foundries and OSATs
- You have experience working with latest Si photonics optical packaging and assembly.
- You have advanced packaging design experience and Design Technology Co-Optimization (DTCO)
- Your strong communication skills and team player mentality make you an asset in a collaborative, global team environment
- Bachelor/Master of Science in physics, optics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
- Minimum of 10+ years of relevant experience inpackaging, physical design implementation, fiber array attachment, optical connector, or related field
What You'll Be Doing:
- Interfacing with foundries and OSATs for 3DIC and advanced packaging vendor evaluation, technology selection, feasibility studies, design, manufacturing, assembly, testing, and qualification.
- Driving internal cross-functional teams for 3DIC, interposer, and substrate design and development from a packaging technology perspective
- Performing prototype design of advanced packaging and related simulations. (3DIC Design)
- Driving IP andchipletdevelopment from DFM and DFR perspectives, including material selection, cross-section, die thickness, die-stacking, TSV placement, and bonding pad design
- Leading internal 3DIC tool feature development and validation to meet IP group needs
- Conducting market studies of emerging packaging technology developments, competitive analysis, and making recommendations for our package development direction
- Providing pre- and post-IP sale packaging technology support
The Impact You Will Have:
- Enhancing Synopsys capability in advanced packaging design and technologies
- Ensuring the reliability and performance of Synopsys IP and test chips through advanced packaging solutions
- Driving innovation in 3DIC and packaging technologies, contributing to Synopsys leadership in the semiconductor industry
- Supporting customers in exploring and optimizing their packaging solution space
- Facilitating the successful integration of Synopsys tools and technologies in customer projects
- Contributing to the development of industry-leading design guidelines and best practices in packaging technology
What You'll Need:
- Domain expertise in 3DIC, advanced packaging, and organic substrate technology, including silicon interposer and substrate manufacturing processes, assembly flow, functional and reliability tests, and qualifications
- Knowledge of advanced packaging and 3DIC offerings from various foundries and OSATs, Experience with 2.5D/3D/3.5D heterogeneous integration technologies such asSoIC,CoWoS, WoW, EMIB,xCUBE, FoCoS, FoEB and OSAT solutions
- Experience with optical, electrical, and thermal mechanical modeling and simulation using Ansys tools (Zemax, Lumerical, AEDT)
- Experience with physical design tools is preferred (ICC2, Fusion Compiler, 3DIC Compiler, Custom Compiler or equivalent tools)
- Hands-on experience with wafer bumping, package assembly, substrate technology, BOM selection, testing, and product development lifecycle
Who You Are:
- A strong communicator and team player
- Capable of working independently with minimal supervision
- Adept at handling significant and unique issues requiring complex evaluation
- Effective in communicating with both internal and external stakeholders
- Possessing extensive expertise and a commitment to contributing to organizational objectives
