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Winbond

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Winbond
Early Applicant
  • Posted 26 days ago
  • Be among the first 10 applicants
3-5 Years
Hong Kong

Electronic Components/Semiconductors

Job Description

(/)

C#/.NET

1.
2. C#ASPASP.NET (MVC/Web API) .NET Core/.NET Framework
3. Web / (Batch Job)
4. (RPA)
5.
6.

(.539)




3

No
No

No


1. 3 C#/.NET Web
2. C#, ASP.NET MVC/Web API, .NET Core/.NET Framework Web
3. MS SQL Server
4. HTML, CSS, JavaScript
5. Git
6.


RPA UiPathPower Automate
AngularReactVue.js CI/CD

#LI-LL1

More Info

Industry:Electronic Components/Semiconductors

Function:??????

Job Type:Permanent Job

Date Posted: 09/09/2025

Job ID: 125842701

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Winbond
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Last Updated: 04-10-2025 10:39:07 PM
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