Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

Qualcomm Overview:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

General Summary:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

General Summary:

Qualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets. This team is responsible for road mapping, working with OSATs, suppliers, internal design and cross-functional teams. Team is looking for experienced packaging engineer who has developed various packaging technologies Flipchip, CSP (Chip-Scale Package), PoP (Package-on-Package), SiP (System in Package), Module package. etc. Some management and integration lead experience will be a plus.

Responsible for exploring, development and HVM deployment of FCCSP, FCBGA, PoP and/or SiP/Module and RDL packaging technologies.
Responsible for initiating & defining package process flow, material set/ BKM, test vehicle, DOEs & cornering, process control plans to successfully develop manufacturable and reliable products.
Interface with OSATs, substrate/ material suppliers, and tool makers in developing technology related to product requirements. Align with internal product teams on Design Rule and its establishment.
Associate with internal design team and drive DFM methodology for new technologies.
Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging.
Technical program management to plan, execute, and monitor complex processes or product developments. Regular updates on program status to management and share with cross team members.
Good knowledge and understanding of SPC/QC concepts, failure mechanism and failure analysis process techniques, manufacturing floor operations and Quality issue handling.

Minimum Qualifications

10+ yrs of experience working in a fast-paced semiconductor packaging environment for consumer products.
IC package development experience in FC-CSP and/or FC-BGA and/or PoP and/or SiP/module and/or RDL Packages (CoWoS).
Assembly or wafer bumping and Fan-out RDL process experiences, such as Die Preparation, flipchip attach, Underfill, Molding, SMT, Photo, Plating, and other key packaging process and material technologies.

Preferred Qualifications

Experience in working with OSATs or major foundry packaging teams.
Process integration experience in taking semiconductor packaging products from development to HVM.
Experience with packaging assembly manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component, component & board level reliability testing.
Good understanding in CPI(Chip Package Interaction) and package reliability.

Educational Requirements

Required: Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related degree or equivalent practical experience.
Preferred: Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related Engineering field.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [HIDDEN TEXT] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

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If you would like more information about this role, please contact Qualcomm Careers.

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