西门 都研中心 硬件工程师-X86架构

IPC Senior HW Engineer If you really want to make a difference - make it with us The Digital Industry Division offers a comprehensive portfolio of seamlessly integrated hardware, software and technology-based services in order to support manufacturing companies worldwide in enhancing the flexibility and efficiency of their manufacturing processes and reducing the time to market of their products - be it the automotive or aerospace industry, mechanical engineering or other interesting sectors. Your mission in new role: Work together with Agile cross-function development team, to invent, design and implement leading industry computing products for Siemens digital industry automation portfolio. Your new role - Challenging and future oriented You will be part of a young, fun, innovate, diverse and international team. You will closely coordinate with embedded software and mechanical engineering teams to plan high-level design of industry computing device. You need have architecture thinking, to consider constraints such as weight, overall dimensions, temperature range of operation, vibration, power consumption, EMC, etc. to achieve high level ruggedness and efficiency, to fulfill our commitment to customers in diversified industry filed application. You will be key person in R&D team to contact with many design partners / vendors, provide clear design requirements to them, make decision based on technical judgment, business benefit including cost, schedule and quality. You need drive the important component strategy with clear technical analysis and understand the big picture and trend, working with material strategy team from local factory and global procurement. You will be involved to track world-wide cutting-edge technologies of computing and semiconductor, estimate alternatives, and integrate the best into your design. Your Qualifications - solid and appropriate Ideally you have successfully completed university education in the areas of Informatics, mathematics, physics, engineering sciences or you will have earned the recognition of such academic achievements based on practical programming experiences. BS above. =5 years design experience on high-volume electronics products. And experiences in working with international team, in product lifecycle management with very good communication skill. You are familiar with world class electrical component vendors (mainboard, graphic card, AI card) and love to cooperate with partners to find out best solution. Strategic thinking, result orientation, decision making is necessary during the cooperation with different partners internal and external. Strong grasp on X86 or ARM architecture, familiar with common periphery high speed design (DDR, PCIe, SATA, USB), signal integrity and power distribution techniques. Familiar DC/DC power topology and common EMC/EMI design principles. Extensive trouble shooting experience with oscilloscopes, multi-meters, logic analyzers, function generators, electronic load banks, power supplies, power analyzers, etc. You are a quick learner for new technologies and good sense at technical and marketing trend. You are fluent in English and good at English communication, additional languages are plus. 产开-IPC 硬件设计 们一起就凡 数字化工业集团供集硬件软件技术务全套，以世界地制公高其制过程活性效率，并缩短其产上时间，包括汽车航空航天机械工程或其他相关产业 使 与 跨能团队作，为西门数字化工业自动化产明设计实施领先IPC产 机战 1. 将为一个年轻有趣创新多元化国际化团队一 2.将与嵌入软件机械工程团队密切调，工业计算设备高级设计 3.需有架维，考外形尺寸工作温度范围振动功耗EMC等约，以实现高水平固性效率，履行们对多元化行业客户承诺 4. 将为团队关人物，与众多设计作伙伴/供商系，他们供明确设计，技术判断商业利益（包括本进度质）出决策 5. 需与本地工全采购料战略团队作，以清晰技术分并了解大局趋势推动零部件战略 6. 将与跟踪世界范围内计算导尖端技术，估计替代方案，并将最佳方案集到设计中 知识技能 1. 想情况下，已功完信学数学物工程学领域大学教，或者将实际编程验获得此类学术就认 2. BS以上 =5 年产设计验以与国际团队作验，在产期管方具有常好沟通技巧 3.熟世界一元器件供商（主显AI），喜欢与作伙伴作寻找最佳解决方案 4在与内外部作伙伴作中，战略维果导决策是必 5. 熟练掌X86或ARM架，熟常外围高速设计（DDRPCIeSATAUSB）信完整性技术熟 DC/DC 常 EMC/EMI 设计原则 6. 丰富示波器万表逻分仪函数器负载功率分仪等故障除验 7是新技术快速学者，对技术趋势有很好洞察力 8. 英语利，长英语交. Organization: Digital Industries Company: Siemens Ltd., China Experience Level: Experienced Professional Full / Part time: Full-time