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Substrate PIE(J44134)

BOE Technology

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5-7 Years
13 days ago
13 Viewed
0 Applied

Job Description

Job Responsibilities
1. Develop new technologies, review the packaging substrate technology route and conduct risk assessment.
2. Responsible for the development and verification of packaging substrate process, establishment of process flow, formulation of experimental plans, FMEA, process cards and other standard documents, tracking and improvement of process-related issues
3. Assist in the review and evaluation of IC substrate equipment
4. Research the advanced IC substrate industry, find the entry point of glass substrate, output feasible technical solutions, and expand the technical direction of new glass-based products
Qualifications
1. Bachelor degree or above, major in electronics or materials, 5 years of HDI/IC substrate work experience
2. Familiar with HDI/IC substrate electroplating, copper sinking, lamination, graphics, solder mask, drilling and surface treatment processes
3. Familiar with advanced packaging process flow and substrate production process, familiar with the mainstream packaging process technology route in the market
4. Familiar with the characteristics of substrate materials, BT/ABF/RCC/PTFE/GF, etc.
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BOE Technology Group Co., Ltd., or Jingdongfang (Chinese: &#20140&#x3B;&#19996&#x3B;&#26041&#x3B;&#31185&#x3B;&#25216&#x3B;&#38598&#x3B;&#22242&#x3B;&#32929&#x3B;&#20221&#x3B;&#26377&#x3B;&#38480&#x3B;&#20844&#x3B;&#21496&#x3B;), is a Chinese electronic components producer founded in April 1993. Its core businesses are interface devices, smart IoT systems and smart medicine and engineering integration.BOE is one of the world's largest manufacturers of LCD, OLEDs and flexible displays.

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Last Updated: 14-06-2024 07:28:17 PM
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