【Client Description】
Responsible for thin film process development, integration, optimization, and mass production transfer for board-level packaging products. This role will establish process capability for metallic layers, dielectric layers, seed layers, barrier layers, and fine-feature interconnect structures to achieve performance, reliability, yield, and cost targets.
- Experience in board-level packaging, advanced packaging, substrate packaging, panel level packaging, fan-out, or embedded substrate.
- Familiar with ABF, PI, PBO, photo-imageable dielectric, or related dielectric materials.
- Experience in fine line / fine pitch process development.
- Experience in high-reliability product development, such as automotive, industrial, or power module applications.
- Experience in equipment qualification, material validation, production ramp-up, and yield improvement.
- Experience in customer technical engagement or supplier management.
【Responsibilities】
- Develop and optimize thin film related processes for board-level packaging, including PVD, sputtering, electroplating, electroless plating, photolithography, wet etching, dry etching, plasma cleaning, and surface treatment.
- Establish and improve process capability for RDL, via opening, seed layer, barrier layer, dielectric layer, and fine line/space structures.
- Evaluate, qualify, and introduce new materials, equipment, and process technologies; define process windows and manufacturing specifications.
- Analyze process defects, failure modes, and reliability risks; lead root cause analysis and corrective actions.
- Build inline monitoring items, SPC control plans, SOPs, and engineering specifications.
- Collaborate with design, equipment, material, quality, reliability, and customer teams to support product development and production ramp-up.
- Support DOE planning, pilot runs, yield improvement, cost optimization, and technical reporting.
- Lead or participate in the development of advanced packaging technologies such as panel level packaging, fan-out packaging, embedded substrate, and power packaging.
