Search by job, company or skills

Showing 1 job

Taiwan, Taichung

Skills:

Thermo-Compression Bonding (TCB), Die Bond (DB), Flip Chip (FC), Rms, AI-powered tools, APC, generative AI solutions, Spc, FDC, semiconductor assembly processes

Early Applicant
Advertisement
Beware of Scammers

We don’t charge money for job offers