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Showing 3 jobs
Skills:
Design of Experiments (DOE), 8D Corrective Action, mSAP process, resins, SLP substrate, Fmea, design specifications and requirements, Test, Risk Assessment, Fabrication, modified semi-additive process, failure analysis techniques, Signal Integrity, Qualification, reliability knowledge, IFD Cause and Effect Analysis, PCB materials, Fishbone, manufacturing, quality control measures, advanced-HDI PCB, PCB manufacturing, laminates
Skills:
Design of Experiments (DOE), 8D Corrective Action, mSAP process, resins, SLP substrate, Fmea, design specifications and requirements, Test, Risk Assessment, Fabrication, modified semi-additive process, failure analysis techniques, Signal Integrity, Qualification, reliability knowledge, IFD Cause and Effect Analysis, PCB materials, Fishbone, manufacturing, quality control measures, advanced-HDI PCB, PCB manufacturing, laminates
Skills:
advanced-HDI PCB, mSAP process, modified semi-additive process, IFD Cause and Effect Analysis, 8D Corrective Action, Fmea, Risk Assessment, failure analysis techniques, Fishbone, SLP substrate
