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Showing 2 jobs
Skills:
wafer bonding , Statistical Analysis, Dashboarding, Data Analytics, Sql, Visual Basic, Process Modeling, Python, E3 FDC Fault Detection and Classification, Spc, Defect analysis, Warpage control, RMS Recipe Management System, Semiconductor process development, R, Doe, Plating, Packaging
Skills:
Data Analytics, Visual Basic, Dashboarding, Python, Sql, R, Spc, E3 FDC, Doe, defect analysis, RMS Recipe Management System
