compressed air , Data Management, Microsoft Excel, Corrective Maintenance, Preventive Maintenance, Hvac, Fire Protection, Autocad, Building Management Systems, Electrical Distribution, Troubleshooting

Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, System-in-Package SiP, Warpage characterization, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans

process qualification , Tool qualification, Standard operating procedures, Preventive Maintenance, Step coverage, Film properties, DOE-driven optimization, Tungsten deposition, Process Documentation, characterization, Metrology, Control Plans, Etch back processes, AMAT Centura tools, Process setup, Uniformity, Continuous Improvement