quality procedures , Automated Test Equipment, ATE Test Programming principles, Semiconductor Manufacturing Test Processes, Hardware design knowledge of LB Probe Card, Process Control, Statistical methods, Data analysis tools, Debug skills, RF ATE Techniques, Advantest 93K, Diamond X, Cohu Unison platform, Diamond 10

statistical data analysis , Advantest 93k ATE platform, Teradyne UltraFlex J750, Exensio platform

assembly processes , wafer-level packaging, flip-chip package development, semiconductor technologies, failure analysis techniques, Autocad, reliability standards, Cadence APD, semiconductor packaging materials, substrate design review