transistors , Pds, Reliability, quality tools such as FMEA, LEDs, operating principles of diodes, 8D, DFQ, ASICs, Product Quality, semiconductor backend processes, DFX, module packaging, quality issue resolution, Validation, Product Engineering, Customer Management, Qualification, semiconductor device physics, module testing process, advanced product quality, VCSELs, Customer Quality Management, Failure Analysis, Reliability Failure Analysis

semiconductor packaging , thermal analysis , mold flow analysis, material characterization, assembly process integration, Back-End Assembly, Failure Analysis, EMC Epoxymoulding Compound, thermo-mechanical analysis, EMC material development, package reliability, reliability assessments

Promotion of Innovation, Basic device physics, Data Analysis, Statistics, DRAM architecture, Reliability Test Flow Development, Cross-Functional Collaboration, DPM reduction, Risk Management, Project Management, Reliability Test Plan and Execution, Root Cause and Resolution of Qual and RMA Device Issues, CMOS technology, Process Conversions and HVM, Mentorship and Development of Others, Technical Decision Making

boundary scan , Perl, Linux Shell Scripting, Python, Tcl, DFT instruments, Synthesis, digital DFT design, MBIST, make, ASIC development, SSN, ATE test, occ, formal verification, EDA Tools, silicon failure analysis, EDT, TAP controller, logic simulation, LBIST

SAS, Sata, Ethernet, Python, Perl, Pcie, Debugging, Board design, BERT, Network Analyzer, Validation, High-Speed IO testing, SERDES equalization technique

power meters , Controllers, alignment algorithms, stages, optical active alignment, laser sources, equipment buyoff, fixture design, MPO connectors, equipment control, equipment qualification, epoxy dispensing