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Showing 2 jobs
Skills:
silicon photonics , technology scouting , Advanced Packaging Lithography, Semiconductor Equipment Development, Heterogeneous Integration, Co-Packaged Optics CPO, Market Intelligence, Wafer-to-Wafer Bonding, Glass Core Packaging, HBM Packaging Technologies, Die-to-Wafer Bonding, Hybrid Bonding, Chiplet Integration, Temporary Bonding Debonding, process integration, RDL Processing
Skills:
silicon photonics , technology scouting , Advanced Packaging Lithography, Semiconductor Equipment Development, Heterogeneous Integration, Co-Packaged Optics CPO, Market Intelligence, Wafer-to-Wafer Bonding, Glass Core Packaging, HBM Packaging Technologies, Die-to-Wafer Bonding, Hybrid Bonding, Chiplet Integration, Temporary Bonding Debonding, process integration, RDL Processing
