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Showing 3 jobs
Skills:
Root Cause Analysis, Signal Power Integrity, Multi-layer FPC and Rigid-Flex technologies, Complex Architecture Design, Bending Analysis
Skills:
Multi-layer FPC and Rigid-Flex technologies, Signal Power Integrity, Complex mechanical stress analysis, Root Cause Analysis
Skills:
systems design , foundry design files, EDA Tools, photonic integrated components, manufacturing pluggable optics, optical transceivers development, IC PCB layout
