Fmea, Product Design Development Cycle, Control Plan, quality engineering, Six Sigma

Wide-Bandgap Semiconductors, IGBT, Fmea, GaN, DC-DC Power Supplies, SIMPLIS, Spice, MTBF Calculations, Power Supply Design, Power Electronics, SiC

Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, System-in-Package SiP, Warpage characterization, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans

AEC-Q100 qualification, Fmea, Semiconductor failure analysis techniques, Automotive reliability requirements, Semiconductor manufacturing processes, Data analytics methodologies, IATF 16949, Optimization, 8D, NPI execution, APQP, Product lifecycle management, Product Engineering, Production Support, Ppap, ISO 26262, ATE test program development, Statistical Techniques

Testing, Data Analysis, process DOE, advanced machine troubleshooting, Calibration, machine setup

Statistical Analysis, Iso 13485, Fmea, Validation protocols, FDA QMSR 21 CFR Part 820, Spc, Gmp, Msa, Quality Tools

Kaizen, IPC standards, Lean, Fmea, 8D methodology, Pmp, Spc, Six Sigma