
Search by job, company or skills
Showing 4 jobs
Skills:
power integrity , Chip-Package Co-Design, Physical Design, floorplanning, Bump Planning, Package Interface Design, Signal Integrity, EDA Tools, Package Design
Skills:
routing, congestion analysis, IR drop, primetime, floorplanning, physical ECO implementation, physical optimization, Cadence Innovus, LVS, Power Planning, Physical Verification, antenna checks, Calibre, Physical Design, StarRC, ERC, Timing Closure, DRC, Placement, sign-off, RTL-to-GDSII, Synopsys ICC2
Skills:
C, Perl, Tcl, Clock Planning, Physical Verification, floorplanning, Placement and Routing, Timing Closure, Physical Design Implementation
Skills:
EM IR understanding and fixes, PV closure, Util area reduction experiments, Physical aware Synthesis using FC, ECO cycle, STA analysis, PnR-Floorplan Macro placement, Density Congestion Timing issues and fixes on lower tech nodes 5nm
