Mass production optical alignment process development, Flip Chip Packaging, Spc, Yield analysis, FMEA process, Active optical alignment equipment, Multi-chip module hybrid bonding, Machine and process interactions, Optical assembly process, Optical Connector to chip attach, Optical Connector Assembly, DFx, 6 sigma quality control, Failure analysis methodologies, Data processing analysis, Process cycle time reduction methodology

Testing, automation solutions, Fmea, Spc, Plating, Dfm, NPI execution, Die Casting, Machining, stamping, Continuous Improvement, Process Design, assembly, Doe, Molding, advanced manufacturing technologies

Excel, Word, 3-D CAD, Powerpoint, Doe, manufacturing technologies, Microsoft Project

Testing, automation solutions, Fmea, Plating, Spc, Dfm, NPI execution, Die Casting, Machining, stamping, Continuous Improvement, Process Design, assembly, Doe, Molding, advanced manufacturing technologies