Testing, automation solutions, Fmea, Plating, Spc, Dfm, NPI execution, Die Casting, Machining, stamping, Continuous Improvement, Process Design, assembly, Doe, Molding, advanced manufacturing technologies

Testing, automation solutions, Fmea, Spc, Plating, lean production, NPI execution, Dfm, Die Casting, stamping, Machining, Continuous Improvement, Process Design, assembly, Doe, Molding, advanced manufacturing technologies

process cycle time reduction methodology, yield analysis, active optical alignment equipment, Flip Chip Packaging, Spc, FMEA process, mass production optical alignment process development, data processing analysis, failure analysis methodologies, Optical Connector to chip attach, multi-chip module hybrid bonding, Optical Connector Assembly, DFx, machine and process interactions, 6 sigma quality control, optical assembly process