3d packaging , process qualification , thermal management , vision systems, semiconductor process characterization, failure analysis workflows, yield analysis, 2.5D Packaging, Flip Chip, Spc, CoWoS, Advanced Packaging, HBM, statistical analysis tools, Chiplet Integration, Doe, alignment systems, warpage control

Excel, Python, data analysis tools, Etching, Lumerical, semiconductor fabrication processes, laser waveguide simulation tools, lithography, deposition, laser simulations, oxidation, DFB lasers, optical electrical behavior, FP lasers, Jmp, EMLs, mask layout design software, Minitab, implantation, Crosslight, external cavity laser modules, Klayout, Doe

Elk, Linux System Administration, Prometheus, Grafana, Pulumi, Python Scripting, Terraform, Ansible, Sonarqube, Helm, Kubernetes, Snyk, GitLab CI, OpenTelemetry, ArgoCD

Elk, Prometheus, Bash, Networking, Grafana, Datadog, Linux Administration, Jenkins, Gcp, Docker, Terraform, Ansible, Distributed Systems, Helm, Azure, Kubernetes, Python, AWS, Go, EFK, GitHub Actions, ArgoCD

Github, Bash, Windows, Jenkins, Devops, Cloud Orchestration, Linux, Terraform, Kubernetes, Python, SRE, AKS, Tooling Engineering, Argo CD