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Job / Role Summary

The Principal Engineer provides technical leadership for NAND Advanced Thin Films, defining technical direction and driving the strategic advancement and integration of sophisticated structural and electrical film processes into manufacturing. Success requires proven leadership in thin film module development, strong cross-functional influence, deep characterization and correlation capability, and strong judgment in technical tradeoffs for manufacturability, scaling, yield, and reliability.

Main Responsibilities

Define and implement technical strategy for structural and electrical film process development aligned to business and technology objectives.
Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices.
Oversee end-to-end development of process modules with focus on manufacturability, scalability, and integration readiness.
Resolve complex technical challenges with significant business implications (root cause analysis, mitigation of process/device failures).
Drive technology transfer and ramp-up activities to enable transition from R&D to high-volume manufacturing.
Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process/material utilization.

Other Responsibilities

Mentor senior engineers and influence technical direction across the organization.
Represent the function in technical forums and strategic collaborations; benchmark against industry standards.
Identify emerging trends/risks/opportunities and recommend future investments/critical initiatives.
Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one's scope of work.

Candidate Profile

Minimum Qualifications / Experience

PhD 5 yrs, or Master's 7 yrs, or Bachelor's 10 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,
With demonstrated experience in Thin Films R&D/PD for NAND including CVD and Diffusion thin films

Must-Have Technical Skills

Mastery of thin film deposition (ALD/CVD) for high-density NAND applications; process design/optimization/integration.
Advanced characterization capability (examples cited: XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation methods (leakage/impedance/capacitance/breakdown).
Proficiency in SPC/DOE/data analytics for optimization and fixing.
Ability to drive novel chemistries/materials/hardware solutions (e.g., chamber design, plasma source optimization, gas delivery).

Must-Have Soft Skills

Technical leadership through influence; strong cross-functional and cross-site collaboration.
Mentorship and clear executive-ready technical communication.

Highly Desirable / Preferred

Competitive benchmarking / industry trend assessment translating into actionable roadmaps.

Embody Micron's Core Values

People – Respect, develop and empower others
Innovation – Drive continuous improvement and breakthrough thinking
Tenacity – Show grit and determination
Collaboration – Build trust and foster teamwork
Customer Focus – Deliver excellence and value

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

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Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND