FMEA process, optical assembly process, Spc, DFx, failure analysis methodologies, 6 sigma quality control, active optical alignment equipment, process cycle time reduction methodology, yield analysis

Optical Connector Assembly, Flip Chip Packaging, Active optical alignment equipment, Hybrid bonding, Optical assembly process, Machine and process interactions, Data processing analysis, Spc, 6 sigma quality control, FMEA process, Mass production optical alignment process development, Failure analysis methodologies, Yield analysis, Multi-chip module, DFx, Process cycle time reduction methodology