Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Hardware Applications Engineering

General Summary:

Join Qualcomm's AI Appliance IoT Edge Team to architect, design, and deliver next-generation edge AI appliances powered by Qualcomm inference cards (AI100, AI200, AI250).

You will work closely with ODMs/OEMs to create robust, scalable, and efficient hardware solutions for industrial, enterprise, and edge deployments, with a strong focus on thermal, power, and mechanical integration.

AI Inference Card Integration

Lead the integration of Qualcomm AI inference cards (AI100, AI200, AI250) into appliance platforms, ensuring optimal electrical, thermal, and mechanical performance.
Define and implement high-speed interconnects (PCIe Gen5/6, Ethernet, DDR5/LPDDR5x) between inference cards and host systems.
Collaborate with ODMs/OEMs to design custom carrier boards, backplanes, and expansion modules for AI inference accelerators.
Develop and validate power delivery architectures to support high-performance AI workloads, including VRMs, PMICs, and redundant power supplies.
Ensure robust cooling solutions for inference cards, including heat sinks, vapor chambers, fans, and liquid cooling, tailored for edge environments.
Support firmware and software integration for card management, BMC, and remote monitoring.

On-Prem Edge Deployment Scenarios

Architect appliance solutions for on-prem edge deployments in industrial, retail, smart city, and enterprise environments.
Design for ruggedization, wide temperature range, vibration, dust, and humidity resistance to meet edge deployment requirements.
Ensure compliance with local and global regulatory standards (CE, FCC, UL, RoHS) for edge appliances.
Optimize mechanical design for compact form factors, wall/rack mounting, and easy field servicing.
Collaborate with system integrators and customers to tailor appliance designs for specific edge use cases (e.g., real-time video analytics, industrial automation, smart retail).
Support remote and on-site deployment, validation, and troubleshooting of edge AI appliances.

General Hardware Engineering

Lead schematic capture, PCB layout, and component selection for high-density, high-speed boards.
Drive cross-functional collaboration with mechanical, thermal, SI, validation, manufacturing, and firmware/software teams.
Conduct design reviews, thermal simulations, and compliance testing.
Travel to ODM/OEM and customer sites as needed for deployment, validation, and troubleshooting.

Required Experience

8+ years in hardware/system design, with significant experience in appliance or edge device development for industrial or enterprise IoT.
Proven track record integrating AI inference accelerators into appliance platforms.
Deep expertise in thermal management, power delivery, and mechanical integration for edge appliances.
Experience with high-layer count PCB design, high-speed serial interfaces, and complex board topologies.
Familiarity with compliance testing, regulatory standards, and environmental requirements for edge hardware.
Hands-on experience with schematic capture and PCB layout tools (Cadence Allegro, Mentor Expedition), and lab equipment (oscilloscopes, logic analyzers, JTAG).
Strong understanding of firmware/software integration, especially BMC and x86 architectures.

Minimum Qualifications

Bachelor's degree in Electrical/Electronic Engineering, Computer Engineering, or related field.
12+ years of hardware engineering experience, including appliance-level design and ODM/OEM collaboration.

Preferred Qualifications

Master's degree in Electrical/Electronic Engineering, Computer Engineering, or related field.
Experience designing edge appliances for AI inference accelerators
Expertise in ruggedized, industrial, or outdoor appliance design.
Experience with regulatory and compliance testing for global edge deployments.

Minimum Qualifications:

Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 6+ years of Software Applications Engineering, Software Development experience, or related work experience.

OR

Master's degree in Engineering, Information Systems, Computer Science, or related field and 5+ years of Software Applications Engineering, Software Development experience, or related work experience.

OR

PhD in Engineering, Information Systems, Computer Science, or related field and 4+ years of Software Applications Engineering, Software Development experience, or related work experience.

3+ years of experience with Programming Language such as C, C++, Java, Python, etc.
3+ years of experience with debugging techniques.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [HIDDEN TEXT] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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If you would like more information about this role, please contact Qualcomm Careers.

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